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PRODID:-//AT Content Types//AT Event//EN
VERSION:2.0
METHOD:PUBLISH
BEGIN:VEVENT
DTSTAMP:20260609T174216Z
CREATED:20080905T143344Z
UID:ATEvent-ea424c12-5958-46b3-8ec0-0cf33aa4a02f
LAST-MODIFIED:20080905T143450Z
SUMMARY:Polymer Bonding for Electronics Packaging
DTSTART:20081017T130000Z
DTEND:20081017T143000Z
DESCRIPTION:C.P. Wong\, Georgia Tech
CATEGORIES:Seminar
URL:http://www.mse.gatech.edu/FacultyStaff/MSE_Faculty_researchbios/Wong/wong.html
CLASS:PUBLIC
END:VEVENT
END:VCALENDAR