BEGIN:VCALENDAR
PRODID:-//AT Content Types//AT Event//EN
VERSION:1.0
BEGIN:VEVENT
DTSTART:20081017T130000Z
DTEND:20081017T143000Z
DCREATED:20080905T143344Z
UID:ATEvent-ea424c12-5958-46b3-8ec0-0cf33aa4a02f
SEQUENCE:0
LAST-MODIFIED:20080905T143450Z
SUMMARY:Polymer Bonding for Electronics Packaging
DESCRIPTION:C.P. Wong\, Georgia Tech
PRIORITY:3
TRANSP:0
END:VEVENT
END:VCALENDAR