Flip Chip system with organic/inorganic underfill composition

Richard Laine

R. Basheer, C. Brick, R.M. Laine, S. Sulaimann, and C. M DeSana (2005)

Filed November 4, 2005. U.S. Patent 7,332,822.

A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.

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