When 3:30 PM - 5:00 PM Jan 10, 2014
Where 1670 Beyster Building
Add event to calendar vCal
iCal

3D Quantification of Microstructures for Integrated Computational Materials Engineering


Alexis Lewis
US Naval Research Laboratory

Quantification of microstructures is critical for accurate and efficient simulation of materials properties and performance. Recent advances in the collection and analysis of three-dimensional microstructural data have allowed for large scale, high-resolution 3D microstructural characterization and quantification. Integrating these experimentally measured datasets, as well as statistically equivalent simulated microstructures, into simulations, allows for accelerated materials discovery as well as accurate prediction of performance in service. n this presentation, the collection, reconstruction, and integrated computational engineering of 3D microstructures of polycrystalline alloys will be discussed. Serial sectioning methods utilizing automated mechanical polishing and electron backscatter diffraction (EBSD) have been applied to a number of systems to collect 3D microstructural data. Two systems will be highlighted; a single-phase BCC system and a highly-twinned FCC system subject to grain boundary engineering. In the former, the crystallography and morphology of the system was quantified extensively, and the microstructure was used as input for finite element simulation of mechanical response. The simulated response was mapped directly to critical microstructural features that govern the onset of plasticity in the system. In the FCC system, a stainless steel of Naval interest (SS 316L) was subject to grain boundary engineering to increase the population of “special” low-energy coincident site lattice boundaries, and the asreceived and engineered specimens were characterized in 3D to determine structureproperty relationships resulting from the grain boundary network connectivities. Finally, I will discuss the management, storage and sharing of the large datasets generated in these endeavors.