When 11:30 AM - 12:30 PM Mar 10, 2009
Where 2150 HH Dow
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Environmentally-Benign Pb-free Metallic Alloys: Complex Load Bearing Materials in Electronic Packaging

Nikhilesh Chawla, Arizona State University

Metallic alloys are an integral part of electronic packaging. Recently, there has been a significant drive to replace Pb-Sn solders with Pb-free, environmentally-benign solders. A fundamental understanding of microstructure evolution and deformation behavior of Pb-free solders is crucial for the successful substitution of these materials in the electronics industry.

In this talk, an overview of the microstructure and thermomechanical behavior of Pb-free solders, in bulk form and at small length scales, will be presented. The importance of the solder microstructure and the role of intermetallic phases formed between solder and copper metallization will be addressed. Experiments coupled with image-based visualization and numerical simulations have been conducted to understand the deformation behavior of these materials. The next generation of Pb-free solder, i.e., rare-earth containing solder with enhanced ductility, will also be discussed.

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