When 3:30 PM - 5:00 PM Oct 07, 2011
Where 1670 CSE
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Tony Rollett, Materials Science and Engineering, Carnegie Mellon University

Tools for ICME: Characterizing and Modeling Materials in Three Dimensions

Successful integration of computational tools into materials engineering will require that the latest tools be brought to bear on the problems.  Many engineered materials have three dimensional polycrystalline microstructures.  This paper surveys the state of the art in tools for characterization and modeling of materials in 3D.  Methods based on serial sectioning are capable of combining different imaging modes such as electron back scatter diffraction, ion channeling, optical, secondary electron, back scattered electron, to mention but a few.  Dual-beam instruments that combine sectioning with imaging provide highly automated technology.  Analysis of the image stacks that exploit crystallographic orientation information, where available, now permits fully 3D information about grains and phases to be extracted at the resolution limit of the imaging technique used.  Registration or alignment of the layers in the image stack involves calculation of correlations between layers, which can be directly based on crystal orientations or microstructural features such as triple lines, or constructs such as mutual information.  Some microstructural aspects such as grain boundary character and interface curvature require surface meshes to be interpolated along grain boundaries.  Such meshes also provide a intermediate step towards construction of 3D finite element (FE) meshes.  Modeling materials response with FE models hardly requires description but there are alternatives.  Image based methods such as phase field, Potts and level set enable many microstructural evolution processes to be simulated, including grain growth, recrystallization, coarsening, sintering etc.  Image based methods such as those based on Fast Fourier transforms (FFT) now enable full-field solutions to be obtained for elastic (including eigenstrains) and viscoplastic problems.  Such tools hold the promise of quantifying many aspects of materials performance, which is exactly what is needed for ICME.

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