The University of Michigan has committed significant resources to improving the quality of its materials science laboratories and making them competitive with the best materials science centers in the United States. Evidence of this commitment to excellence in research facilities can be found in the Michigan Ion Beam Laboratory for Surface Modification and Analysis, the Electron Microbeam Analysis Laboratory, and the Solid State Fabrication Facility. Completely new polymer characterization laboratories are being developed, as are laboratories for materials synthesis and processing. Graduate students have full access to all MSE laboratories and research equipment including:


Electron Optical Facilities

  • The Michigan Center for Materials Characterization (MC)2 is a university-wide user facility for the microstructural and microchemical characterization of materials. The laboratory was originally established in 1978 with the goals of providing and maintaining state-of-the-art equipment for use by the university research community. The laboratory was divided into two when the Department of Materials Science & Engineering moved to its current North Campus location.
  • Philips XL30 Scanning Electron Microscope

Mechanical Testing Facilities

  • MTS 810 Servohydraulic System (22Kip) with hydraulic grips, ceramic extensometers and microprofiler interface
  • Instron 1335 Servoelectrical Test System (25Kip) with microlink interface
  • Instron 1362 Servohydraulic Test System (220Kip) with high temperature, high pressure test capabilities
  • Harwood Engineering fluid pressure generator (14kB)
  • Harwood Engineering 2-stage gas compressor (14kB)
  • Pressure vessels (10kB) with air or atmosphere test furnaces (1500 degrees C)
  • MTS Series 810 Servohydraulic Test System (22Kip) with hydraulic grips, IBM CS9000 interface for cyclic plastic strain control and potential drop and compliance-based automated fatigue crack growth.
  • Instron Model 1332 Electrohydraulic Test System with high frequency actuator and computer control for dynamic and transient testing of polymers
  • Instron Model 1331 Electrohydraulic Test System for high frequency fatigue of polymers
  • Instron Model 4502 Test System with complete digital control
  • ICI Instrumented Impact Tester
  • Instron Model 4505 Test System with complete digital control equipped with a 3-zone, 1000 degrees C furnace
  • Instron Model 1137 with a computerized data acquisition system
  • High temperature plateau press for superplastic forming
  • Instron Model 1116, 250kN capacity, equipped with a Research Optics radiant heating furnace
  • Creep testing facility with 30 creep and stress rupture units
  • Instron Model 4204 programmable mechanical testing facility for thin (50 kN) film measurements
  • Nikon hot hardness tester
  • DuPont 983 dynamic mechanical analyzer
  • Metravib torsion pendulum

Polymer Characterization and Processing Facilities

  • Three Tian-Calvert microcalorimeters.
  • Two Perkin Elmer DSC-7 differential scanning calorimeters.
  • General Radio dielectric spectrometer.

Solidification Processing Facilities

  • Vacuum induction melting furnace, tilt-pouring, 5.0 kg capacity, 50kw, 3000 Hz induction.
  • Plasma arc melting furnace, water-cooled 9-inch copper hearth, inert atmosphere.
  • Vacuum melt spinner for RSP, 1 kg capacity, inert gas.
  • Electron beam single crystal grower.
  • High temperature, high vacuum induction unit for gas-metal reactions.
  • Centour directional solidification furnace with > 2000 degree C capability.
  • Two TAI differential thermal analyzers (1600 degree C.)
  • Matson fourier transform infrared spectrometer.
  • Dupont 983 dynamic mechanical analyzer
  • Instron capillary rheometer.
  • Brabender Plasticorder.
  • Battenfeld 1-oz. reciprocating screw injection molding machine.
  • Sterling 1 1/2-inch extruder.
  • Rheometrics mechanical spectrometer.
  • Two Hercules rotational viscometers.
  • Ferranti-Shirley cone and plate viscometer.
  • Tetrahedron Smartpress Compression Molding Instrument.
  • 337 nm UV N2 laser.

Michigan Ion Beam Laboratory (Nuclear Engineering)

  • 1.7 MV Tandetron accelerator for ion beam mixing, ion implantation,
  • Rutherford backscattering, ion channeling, PIXE and NRA.
  • Varian 400-10A Ion Implanter.
  • Varian CF3000 Ion Implanter.
  • Ion beam-assisted deposition system.
  • Dual electron beam gun, high vacuum evaporator for thin film synthesis.
  • Turbo-pumped vacuum furnace for thin film annealing.

UHV Thin-Film Growth and Analysis Laboratory

  • Ultrahigh vacuum, thin film growth and analysis chamber.
  • Three 40 cc electron beam evaluators.
  • Three Knudson cells.
  • Auger electron spectroscopy.
  • Reverse-view low energy electron diffraction.
  • 30 keV electron gun for RHEED.
  • CCD image analysis system for RHEED and LEED.

High Temperature Corrosion Laboratory

  • High pressure (3000 psi), hightemperature (360 degrees C) recirculating test loop with all wetted surfaces of titanium.Loop is connected to a multi-sample autoclave in a 6000 lb. CERT machine.
  • Two-liter autoclave mounted in a 10,000 lb. constant extension rate machine (CERT) capable of extension rates as low as 5 x 10-8 in/s.
  • (2) Two-liter static titanium autoclaves.
  • (2) 2000 lb. constant extension rate machines.
  • Princeton Applied Research Corrosion Measurement System consisting of three potentiostats, one universal programmer, and one digital coulometer, all interfaced with an IBM-PC computer.

X-Ray Equipment

  • Rigaku MiniFlex X-Ray Diffractometer
  • Siemens KRISTALLOFLEX generator with Four crystal plane wave camera and Four-circle goniometer.
  • J. D. Hanawalt X-Ray MicroAnalysis Laboratory (XMAL)
    • Rigaku 12 kw high intensity rotary anode generator with wide-angle horizontal diffractometer equipped with low-temperature camera.
    • Complete on-line JCPDS powder data file for automated phase identification.
    • Horizontal diffractometer with fully computer automated pole figure device.
    • Bede D1 High Resolution X-Ray Diffractometer
    • Bruker NanoStar SAXS
    • Bruker AXS D8 Discover XRD with Hi-Star Area Detector

Other Insturmentation

  • Six Nikon Optiphot optical microscopes.
  • Nikon SMZ10 stereo microscope.
  • Leco CS-244 Carbon/Sulfur Determinator with HF-1000 induction furnace.
  • Leco RO-316 Oxygen Determinator with EF-100 electrode furnace.
  • Leco TN-114 Nitrogen Determinator with EF-100 electrode furnace.
  • Perkin Elmer 503 atomic absorption spectrophotometer.
  • Fully-equipped metallographic facilities.

Solid State Electronics Laboratory (Electrical Engineering)

  • Equipment for mask making, photolithog-raphy, oxidation and diffusion, dry pattern transfer (plasma, RIE, ion-beam) deposition and milling, vacuum evaporation and sputtering, chemical vapor deposition, and molecular-beam epitaxy.
  • Facilities for characterization of III-V semi-conducting materials, high performance silicon gate NMOS circuits, and sub-microngate MOSFET structures.
  • Instrumentation for device characterization to 115 GHz.
  • Full range of process tools - including electron-beam lithography,
  • MBE (three new machines,) ion implantation, and LPCVD.
  • 4,000 square feet of active class-100 processing area.
  • 1,000 square feet of class-10 space devoted to submicron lithography.
  • Extensive equipment for materials characterization and properties measurements.